第七條　第8款1.專利、商標、著作或其他智慧財產權之內容:Semiconductor Memory Device And Writing Method Of ID code AndUpper Address Thereof2.專利、商標、著作或其他智慧財產權之取得日期:102/08/273.取得專利、商標、著作或其他智慧財產權之成本:NT＄300,0884.其他應敘明事項:A semiconductor chip D1 of a flash memory which is stacked together withother semiconductorchips D2~DN to form a multi-chip package (MCP),including a memory cell array 20 of the flash memory for storing an IDcode and an upper address, wherein the ID code is written into the afuse data region 20F of the memory cell array 20 before the assemblyprocess. According to the invention, ID codes and upper addresses can bedesignatedassigned and written to each of the semiconductor chips of amulti-chip package easily without increasing the size of the semiconductorchips in comparison with the prior art.